High Temperature, Chemical Resistant Polyimide Label Materials for Harsh Environment Applications
The Challenge of PCB Manufacturing
PCB manufacturers use reflow or wave soldering to join the electrical connection on their PCBs.
The reflow process typically includes many stages or zones as shown in the diagram at right. During the soldering process the PCB bond pads are covered with solder paste, a mixture of powdered solder alloy & flux that helps attach the electronic components to the circuit board. The PCB is then subjected to a preheat cycle with temperatures reaching 120°C. In some applications, there may also be a thermal soak stage that helps remove volatile substances and activates the flux. The PCB is then heated to the melting point of the solder and the molten solder permanently connects the component joints.
As a result of the RoHS lead-free initiative, lead-based solders, requiring 200-220°C to process, were replaced by silver solders which require temperatures of 240-260°C. Recently, tin/copper solders, which offer more cost effective solutions to silver, are also being used and require up to 280°C.
After the PCB cools down it is then cleaned in an aggressive chemical wash with, in many cases, the entire process repeated multiple times thus the need for durable top coats.
Chemically Resistant Label Materials
Polyonics label materials with next generation coatings and adhesives have been engineered to not soften or yellow at the highest temperatures found in PCB manufacturing. These new label materials will also resist abrasion if contacted at elevated temperatures and will withstand the harshest, highly active fluxes used in the industry (e.g. ORH1). In addition, they are also fully resistant to the most concentrated post-process cleaning chemistries.
- Higher temperature requirements
- Improved adhesive capability
- Maintaining the color and integrity of the label material
Polyonics moved quickly to support these regulations and launched a new product series of durable label materials designed to reach the elevated temperatures that would be found in the PCB manufacturing with the removal of lead from the process.
Since the lead free process was initiated Polyonics product line, based on its Thermogard technology, has proven to meet & exceed the harsh requirements found in lead free reflow & wave solder environments for PCB and component processing.
For most of the 2 mil high temperature polyimide products there is a cost effective 1 mil alternative that maintains the same durability standards at a lower price.
All materials are thermal transfer printable and exhibit the highest PCS and first read rates. Polyonics label material has excellent chemical and abrasion resistance and have proven to be successful in the hostile environments in the PCB manufacturing process.
Our 1 & 2 mil materials use a permanent acrylic adhesive and are available in a wide variety of colors & finishes. Silicone adhesive is available for applications were extreme heat exposure is a factor.
The Polyonics durable tracking labels are designed to maintain the integrity of printed bar codes and images throughout the harshest, multi-cycle PCB manufacturing process helping manufacturers accurately control their PCB inventories.
The new label materials are available in one mil (XF-731) or two mil (XF-732) constructions and, as all Polyonics label materials, are halogen free and REACH & RoHS compliant.
To view a complete listing of our high temperature circuit board labels, check out our Polyimide product line.
- Printed circuit board identification
- Component tracking
- Warranty labels
- Clean room, low outgassing applications
- Asset tracking
- Warning labels
- Product identification
To learn more about these unique performance labels, call our technical experts at (603)352-1415 or request information.
|XF-518||1 mil Polyimide||Matte||High Temperature, UL969||PCB Identification|
|XF-519||2 mil Polyimide||Matte||High Temperature, Auto Apply, UL969||PCB Identification|
|XF-528||1 mil Polyimide||High Gloss||High Resolution Printing, UL969||PCB Identification|
|XF-529||2 mil Polyimide||High Gloss||High Resolution Printing, Auto Application, UL969||PCB Identification|
|XF-552||2 mil Polyimide||High Gloss||High Resolution Printing, Auto Application||PCB Identification|
|XF-581||1 mil Polyimide||Semi- Gloss||High Temperature, UL969/CUL||PCB Identification|
|XF-582||2 mil Polyimide||Semi- Gloss||High Temperature, Auto Apply, UL969||PCB Identification|
|XF-583||1 mil Polyimide||Matte||High Temperature, UL969/CUL||PCB Identification|
|XF-584||2 mil Polyimide||Matte||High Temperature, Auto Apply, UL969||PCB Identification|
|XF-592||2 mil Polyimide||Semi-Gloss||High Temperature, Auto Apply, UL969||PCB Identification|
|XF-603||1 mil Polyimide||Semi-Gloss||UL94 Flame Retardant, Auto Apply, UL969||Electronic Devices|
|XF-611||1.5 mil Polyimide||Semi-Gloss||UL94 Flame Retardant, Auto Apply, UL969||Electronic Devices|
|XF-616||0.5 mil Polyimide||Semi-Gloss||Ultra Thin, UL969||Space Constrained Electronics|
|XF-731||1 mil Polyimide||Semi-Gloss||Flux Resistant, UL969||PCB Identification|
|XF-732||2 mil Polyimide||Semi-Gloss||Flux Resistant, Auto Apply, UL969||PCB Identification|
|XF-781||1 mil Polyimide||Semi-Gloss||ESD Static Dissipative, Low Tribocharging, UL969||Electronic Components|
|XF-782||2 mil Polyimide||Semi-Gloss||ESD Static Dissipative, Low Tribocharging, Auto Apply, UL969||Electronic Components|
|XF-784||1 mil Polyimide||Matte||No Preheat, ESD Static Dissipative, Low Tribocharging, UL969||PCB Identification|