Circuit Board Labels:Lead Free Polyimide Labels and Kapton® Labels lead free polyimide labels lead free kapton labels

Polyimide Labels in Lead Free Soldering Applications.....Requires Higher Solder Temperatures

Higher temperatures can adversely affect ordinary polyimide labels in use today...

The first photo shows the effects of extended time and temperature (300°C/572°F for 30 minutes) on a "standard" polyimide label from a competitor, compared to a new generation, lead free polyimide label XF 581 and XF 582. The 58 series of polyimide labels are designed for the higher temperatures required for lead free soldering processes.

Polyonics XF 582         Competitor's Polyimide Label
Lead free polyimide labels, lead free solder, lead free polyimide label material, Kapton® label material

 

 

 

The second photo shows XF 552 polyimide label material after heating under the same conditions, compared to a competitor's white polyimide label, heated under the same conditions. The XF 552 undergoes NO color change...it remains the same "school bus yellow" color that it was prior to heating

.Lead free polyimide labels, lead free solder, lead free polyimide label material, Kapton® label material

The European Union's Waste of Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) mandates lead free electronic manufacturing by August, 2006...that's 1 year away. .

Lead-free solder requires higher processing temperatures than traditional tin-lead alloys, which most certainly will affect polyimide labels for circuit board ID. In general, fluxes used for lead-free flow soldering must be able to withstand topside PCB preheat temperatures as high as 130 °C and solder temperatures as high as 280 °C for a minimum of 3 seconds of contact time or longer.

PREHEAT CYCLE: For most lead-free flow soldering applications, the topside PCB temperature will increase by as much as 125% from 50-60 °C, to approximately 110- 130 °C to limit the thermal shock, as the PCB contacts the higher temperature of the lead-free molten solder.

SOLDER POT: The solder pot temperature will be as high as 260-280 °C for Tin-Copper solders, compared to 220-240 °C required for ordinary lead-tin solders in use today.

Each label material used must be re-evaluated against these new thermal profiles. If polyester was used in a location, which now experiences the higher temperatures (and renders it useless), then the label must be changed to a different material, such as PEI or Polyimide (Kapton®) label material. The higher temperatures may also require that standard polyimide labels be changed to new polyimide labels specifically engineered for these lead-free processes.

Data sheets and samples are available for the new Polyonics THERMOGARD™:

1 mil white polyimide labels (gloss) for lead free soldering 

2 mil white polyimide labels (gloss) for lead free soldering

1 mil white polyimide labels (matte) for lead free soldering 

2 mil white polyimide labels (matte) for lead free soldering

2 mil yellow polyimide labels for lead free soldering

FREE SAMPLES AVAILABLE are available at Lead Free Polyimide Samples.

In all cases, TEST, TEST, TEST the existing barcode labels, as well as any new circuit board labels proposed for use. You can find a more detailed discussion of these issues at LEAD FREE DISCUSSION.  Or, click on the FAQS  page. You will see a heading for "Lead Free Initiative".

 

 
 
 
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