Thermal Interface Materials - Product Data Sheets

Thermal Interface Material Data Sheets

As you design your devices to be faster, smaller and more powerful, you need to protect their high powered electrical components from heat, which can lead to degraded performance and damage.

 

View and download our Data Sheets below for the product material that you require. Data Sheet information includes:

 

  • Total Thickness
  • Thermal Resistance
  • Volume Resistivity
  • Max. Temperature All TIMs: 1,000 hrs. at 437°F (225°C)
Thermal Interface tape

Film: 0.5 mil (127 µm)Polyimide

Adhesive: 1.5 mil (40 µm) Silicone double coated

Download PT-810 Data Sheet
Thermal Interface tape

Film: 1.5 mil (38 µm)
Kapton MT + Polyimide

Adhesive: 1.5 mil (40 µm) Silicone double coated

Download PT-812 Data Sheet

Thermal Interface tape

Film: 1.5 mil (38 µm)
Kapton MT + Polyimide

Adhesive: 3 mil (80 µm) Silicone double coated

Download PT-813 Data Sheet
Thermal Interface tape

Film: 1.5 mil (38 µm)
Kapton MT + Polyimide

Adhesive: 1.5 mil (40 µm) Silicone single coated

Download PT-816 Data Sheet
Thermal Interface tape

Film: 2 mil (51 µm)
Aluminium

Adhesive: 1.5 mil (40 µm) Silicone double coated

Download PT-811 Data Sheet

Have Questions? Ask Our Experts

To learn more about our unique materials, call our technical experts at (603)352-1415 or click to request information..

Read more about our material solutions below:

Bologna

ESD Safe

Performance Labels

Designed to protect your most sensitive components

Read More Download the Brochure
Bologna

Engineered Tapes

Mask, insulate, bond and protect

solve issues with extreme static charge, high temperature, and other harsh environments.

Read More Download the Brochure
Bologna

Flexible Substrates

For applications related to the electronics industry

Designed to be printed with conductive, semi-conductive and resistive inks.

Read More Download the Brochure
Bologna

Thermal Interface Materials

Maximum thermal management - excellent long-term performance

Move heat more efficiently through the material to constant cool the component.

Read More Download the Brochure

 

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